Solid-state imaging device and electronic apparatus

ABSTRACT

A solid-state imaging device includes a plurality of pixels each of which includes a photoelectric conversion unit that generates charges by photoelectrically converting light, and a transistor that reads a pixel signal of a level corresponding to the charges generated in the photoelectric conversion unit. A phase difference pixel which is at least a part of the plurality of pixels is configured in such a manner that the photoelectric conversion unit is divided into a plurality of photoelectric conversion units and an insulated light shielding film is embedded in a region for separating the plurality of photoelectric conversion units, which are divided, from each other.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.15/806,141, filed Nov. 7, 2017, which is a continuation of U.S. patentapplication Ser. No. 15/288,234, filed Oct. 7, 2016, now U.S. Pat. No.9,837,456, which is a continuation of U.S. patent application Ser. No.14/954,506, filed Nov. 30, 2015, now U.S. Pat. No. 9,524,999, which is acontinuation of U.S. patent application Ser. No. 14/311,967, filed Jun.23, 2014, now U.S. Pat. No. 9,288,380, which claims priority to JapanesePatent Application No. JP 2013-136217, filed Jun. 28, 2013, the entiredisclosures of which are hereby incorporated herein by reference.

BACKGROUND

The present disclosure relates to a solid-state imaging device and anelectronic apparatus, and in particular, to a solid-state imaging deviceand an electronic apparatus, capable of obtaining a better phasedifference detection accuracy.

In the related art, in an electronic apparatus with an imaging function,such as a digital still camera and a digital video camera, solid-stateimaging devices such as, a Charge Coupled Device (CCD) and aComplementary Metal Oxide Semiconductor (CMOS) image sensor are used.The solid-state imaging device includes pixels in each of which aphotodiode (PD) performing photoelectric conversion and a plurality oftransistors are combined, and an image is formed based on pixel signalswhich are output from a plurality of the pixels which arranged in aplane manner.

For example, in the solid-state imaging device, charges accumulated inthe PD are transferred to a Floating Diffusion (FD) unit having apredetermined capacity which is provided in a connection portion betweenthe PD and a gate electrode of an amplifying transistor. Then, signalscorresponding to a level of the charges stored in the FD unit are readfrom the pixel and AD-converted by an Analog Digital (AD) conversioncircuit having a comparator so as to output AD-converted signals.

In recent years, a technology of detecting a phase using a part of animaging pixel of a CMOS image sensor so as to increase a speed ofAutofocus (AF), a so-called image plane phase difference AF, has beenwidely spread. The image plane phase difference AF includes a one-sidedlight shielding method and a PD division method.

For example, Japanese Unexamined Patent Application Publication No.2001-250931 discloses a solid-state imaging device adopting the imageplane phase difference AF of the one-sided light shielding method, withwhich distance measurement is possible by covering approximately a halfof the PD with a light shielding film in order for a portion of thelight shielding film of a pixel to have a bias with respect to anoptical center of a microlens.

Further, Japanese Unexamined Patent Application Publication No.2000-292685 discloses a solid-state imaging device adopting the imageplane phase difference AF of the PD division method, with which distancemeasurement is possible by dividing the PD in one pixel into two and byobtaining phase information from respective divided PDs.

For example, since the one-sided light shielding method can shield aportion on one side of the pixel by using the light shielding film orthe like used in an existing wiring layer or an optical black region, ithas been known that a structure can be made easily. Meanwhile, since twoimaging pixels as a pair having different opening directions are desiredfor detecting the phase and it is difficult to obtain pixel values fromthe imaging pixels, it is necessary to complement pixel values fromsurrounding pixels.

In contrast, since the PD division method divides one PD into two, onlyone imaging pixel may be used and the complement of the pixel value maybe achieved relatively easily.

SUMMARY

However, in the PD division method, since a plurality of divided PDs fordetecting a phase difference are located very close to each other, whenlight with a great incident angle, among light incident from amicrolens, is incident on the PD, the light leaks to the adjacent PD,and thus the phase detection accuracy deteriorates.

The present disclosure is made in view of such circumstances, and isintended to achieve a better phase difference detection accuracy in thePD division method.

According to an embodiment of the present disclosure, there is provideda solid-state imaging device including: a plurality of pixels each ofwhich includes a photoelectric conversion unit that generates charges byphotoelectrically converting light; and a transistor that reads a pixelsignal of a level corresponding to the charges generated in thephotoelectric conversion unit, in which a phase difference pixel whichis at least a part of the plurality of pixels is configured in such amanner that the photoelectric conversion unit is divided into aplurality of photoelectric conversion units and an insulated lightshielding film is embedded in a region for separating the plurality ofphotoelectric conversion units, which are divided, from each other.

According to another embodiment of the present disclosure, there isprovided an electronic apparatus including: a solid-state imaging deviceincluding a plurality of pixels each of which includes a photoelectricconversion unit that generates charges by photoelectrically convertinglight; and a transistor that reads a pixel signal of a levelcorresponding to the charges generated in the photoelectric conversionunit, in which a phase difference pixel which is at least a part of theplurality of pixels is configured in such a manner that thephotoelectric conversion unit is divided into a plurality ofphotoelectric conversion units and an insulated light shielding film isembedded in a region for separating the plurality of photoelectricconversion units, which are divided, from each other.

In the embodiments, the phase difference pixel which is at least a partof the plurality of pixels is configured in such a manner that thephotoelectric conversion unit is divided into a plurality ofphotoelectric conversion units and an insulated light shielding film isembedded in a region for separating the plurality of photoelectricconversion units, which are divided, from each other.

According to the embodiments of the present disclosure, it is possibleto achieve a better phase difference detection accuracy.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram illustrating a configuration example of asolid-state imaging device according to an embodiment of the presenttechnology;

FIGS. 2A and 2B are diagrams illustrating a first configuration exampleof the solid-state imaging device;

FIGS. 3A and 3B are diagrams illustrating a second configuration exampleof the solid-state imaging device;

FIGS. 4A and 4B are diagrams illustrating a third configuration exampleof the solid-state imaging device;

FIGS. 5A and 5B are diagrams illustrating a reading of pixel signalsfrom phase difference pixels;

FIGS. 6A and 6B are diagrams illustrating a detection of a phasedifference in an oblique direction;

FIGS. 7A and 7B are diagrams illustrating a detection of a phasedifference in a vertical direction and a horizontal direction;

FIGS. 8A and 8B are diagrams describing a reading of pixel signals fromone PD and all PDs;

FIG. 9 is a diagram illustrating a modified example of the phasedifference pixel;

FIGS. 10A and 10B are diagrams illustrating a part of a pixel array unitin which the phase difference pixel is partially disposed;

FIGS. 11A and 11B are diagrams illustrating a part of a pixel array unitin which the phase difference pixels are entirely disposed;

FIG. 12 is a diagram illustrating a fourth configuration example of thesolid-state imaging device;

FIGS. 13A and 13B are diagrams illustrating a modified example of thephase difference pixel; and

FIG. 14 is a block diagram illustrating a configuration example of animaging apparatus mounted on an electronic apparatus.

DETAILED DESCRIPTION OF EMBODIMENTS

Hereinafter, specific embodiments in which the present technology isapplied will be described in detail with reference to drawings.

FIG. 1 is a block diagram illustrating a configuration example of asolid-state imaging device according to an embodiment the presenttechnology.

As illustrated in FIG. 1, a solid-state imaging device 11 is a CMOS-typesolid-state imaging device, and is configured to include a pixel arrayunit 12, a vertical driving unit 13, a column processing unit 14, ahorizontal driving unit 15, an output unit 16, and a driving controlunit 17.

The pixel array unit 12 includes a plurality of pixels 21 which arearranged in an array shape, is connected to the vertical driving unit 13through a plurality of horizontal signal lines 22 corresponding to thenumber of rows of the pixel 21 and is connected to the column processingunit 14 through a plurality of vertical signal lines 23 corresponding tothe number of columns of the pixel 21. In other words, the plurality ofpixels 21 included in the pixel array unit 12 are respectively disposedat points in which the horizontal signal lines 22 and the verticalsignal lines 23 intersect.

The vertical driving unit 13 sequentially supplies drive signals fordriving (transferring, selecting, resetting, or the like) the respectivepixels 21 to the respective rows of the plurality of pixels 21 includedin the pixel array unit 12 through the horizontal signal line 22.

The column processing unit 14 extracts the signal levels of the pixelsignals by performing a Correlated Double Sampling (CDS) process on thepixel signals which are output from the respective pixels 21 andacquires pixel data corresponding to the amount of received light of thepixels 21, through the vertical signal line 23.

The horizontal driving unit 15 sequentially supplies the columnprocessing unit 14 with drive signals for outputting the pixel datawhich is acquired from the respective pixels 21 from the columnprocessing unit 14, for each column of the plurality of pixels 21included in the pixel array unit 12.

The pixel data is supplied from the column processing unit 14 to theoutput unit 16 at a timing corresponding to the drive signal of thehorizontal driving unit 15, and the output unit 16 amplifies, forexample, the pixel data and outputs the amplified pixel data to an imageprocessing circuit in the subsequent stage.

The driving control unit 17 controls the driving of each block in thesolid-state imaging device 11. For example, the driving control unit 17generates a clock signal according to the driving period of each blockand supplies the clock signal to each block.

FIGS. 2A and 2B are diagrams illustrating a first configuration exampleof the solid-state imaging device 11. FIG. 2A illustrates across-sectional configuration example of the solid-state imaging device11 which is the first configuration example, and FIG. 2B illustrates aplanar configuration example of the solid-state imaging device 11.

As illustrated in FIGS. 2A and 2B, the solid-state imaging device 11 isconfigured with a wiring layer 31, a sensor layer 32, a color filterlayer 33, and an on-chip lens layer 34 which are laminated. FIGS. 2A and2B illustrate a pixel 21 a capable of outputting a pixel signal used forphase difference detection and a normal pixel 21 b outputting only apixel signal forming an image, among the plurality of pixels 21 disposedin the pixel array unit 12. Hereinafter, appropriately, the pixel 21 aand the pixel 21 b are respectively referred to as a phase differencepixel 21 a and an imaging pixel 21 b; and when there is no need todistinguish the pixel 21 a and the pixel 21 b, they are simply referredto as the pixel 21.

The wiring layer 31 includes a plurality of layers of wirings 41 formedbetween interlayer insulating films 42, and three layers of wirings 41-1to 41-3 are formed in the configuration example of FIGS. 2A and 2B.

The sensor layer 32 includes a fixed charge film 53 and an insulatingfilm 54 which are laminated on a semiconductor substrate 52 having PD 51formed therein.

The PD 51 is formed by a PN junction, generates charges byphoto-electrically converting the received light and to accumulate thegenerated charges. The semiconductor substrate 52 is a silicon substrate(P well) to which P-type impurities are injected. The fixed charge film53 is a film that stores, for example, negative fixed charges, andsuppresses the generation of a dark current at a boundary surface of thesemiconductor substrate 52. In addition, an insulating film may be usedinstead of the fixed charge film 53. The insulating film 54 is a filmhaving an insulating property and insulates the surface of thesemiconductor substrate 52.

Further, in the sensor layer 32, one PD 51 b is formed in the imagingpixel 21 b, whereas two PDs 51 a ₁ and 51 a ₂ are formed in the phasedifference pixel 21 a. Then, an engraved light shielding film 55insulated from the semiconductor substrate 52 is formed between the PDs51 a ₁ and 51 a ₂ of the phase difference pixel 21 a, in the sensorlayer 32, and a barrier metal 56 is formed between the engraved lightshielding film 55 and the fixed charge film 53. In other words, asillustrated in FIG. 2B, in the phase difference pixel 21 a, the PDs 51 a₁ and 51 a ₂ are separately formed, and the engraved light shieldingfilm 55 is formed in a region for separating the PDs 51 a ₁ and 51 a ₂from each other in a shape of “I” when viewed in a plan view.

The engraved light shielding film 55 is formed within a trench formed byengraving the semiconductor substrate 52. For example, the trench isformed in the semiconductor substrate 52 between the PDs 51 a ₁ and 51 a₂, and the fixed charge film 53 and the barrier metal 56 are appliedinside of the trench. Thereafter, the engraved light shielding film 55is formed by embedding, for example, a metal having a light shieldingproperty in the trench.

The barrier metal 56 is a metal film which is formed for diffusionpreventing or interaction preventing of a metal material forming theengraved light shielding film 55.

The color filter layer 33 has a configuration in which filters 61 ofpredetermined colors, for example, the filters 61 of red, green and blueare arranged in a so-called Bayer array. In FIGS. 2A and 2B, a filter 61a of the color the phase difference pixel 21 a receives and a filter 61b of the color the imaging pixel 21 b receives are illustrated.

The on-chip lens layer 34 includes a microlens 62 that condenses lightincident on the solid-state imaging device 11 to each pixel 21. In FIGS.2A and 2B, a microlens 62 a that condenses the light to the PDs 51 a ₁and 51 a ₂ of the phase difference pixel 21 a and a microlens 62 b thatcondenses the light to the PD 51 b of the imaging pixel 21 b areillustrated.

In this manner, the solid-state imaging device 11 is configured in sucha manner that the PDs 51 a ₁ and 51 a ₂ of the phase difference pixel 21a are separated by the engraved light shielding film 55. Thus, in thesolid-state imaging device 11, it is possible to prevent the lightincident on one of the PDs 51 a ₁ and 51 a ₂ of the phase differencepixel 21 a in an oblique direction from being mixed into the others ofthe PDs 51 a ₁ and 51 a ₂ (hereinafter, referred to as opticalcrosstalk) by the engraved light shielding film 55. In other words, asindicated by an arrow of a dotted line in FIGS. 2A and 2B, for example,reflection of the light incident on the PD 51 a ₁ in an obliquedirection on the engraved light shielding film 55 and mixing of thelight into the PD 51 a ₂ are prevented.

Further, in the solid-state imaging device 11, it is possible to preventthe charges generated in one of the PDs 51 a ₁ and 51 a ₂ of the phasedifference pixel 21 a from being mixed into the others of the PDs 51 a ₁and 51 a ₂ (hereinafter, referred to as electric crosstalk) by theengraved light shielding film 55.

In this manner, in the solid-state imaging device 11, it is possible toprevent the electric crosstalk and the optical crosstalk between the PDs51 a ₁ and 51 a ₂ of the phase difference pixel 21 a, and to avoid thedeterioration of the phase difference characteristic (characteristic ofaccuracy for detecting a phase difference).

For example, in the solid-state imaging device of the related art, sincedevice isolation for dividing PD is performed by forming a region havinga deep P-type impurity concentration, the optical and electric isolationbetween the divided PDs are weak and the phase difference characteristicis deteriorated. For example, if a wider region having a deep P-typeimpurity concentration is formed in order to improve the optical andelectric isolation of the divided PDs, the area of the PD is reduced.Therefore, it is difficult to obtain a phase difference signal of a highlevel, in contrast, the influence of noise increases, and thus the phasedifference characteristic deteriorates.

In contrast, in the solid-state imaging device 11, since the electricisolation and the optical isolation between the PDs 51 a ₁ and 51 a ₂can be strengthened by the engraved light shielding film 55 as comparedto the solid-state imaging device of the related art, it is possible toprevent the phase difference characteristic from being deteriorated.Thus, the solid-state imaging device 11 can achieve a better phasedifference characteristic.

Further, in the solid-state imaging device 11, the pixel signals whichare output from the PDs 51 a ₁ and 51 a ₂ of the phase difference pixel21 a are added and thus the pixel signals can be used for forming animage. Thus, it is possible to prevent deterioration in an image qualityand to obtain an image with higher image quality as compared to a caseof complementing a pixel value of the phase difference pixel from theadjacent pixels by the one-sided light shielding method as describedabove.

FIGS. 3A and 3B are diagrams illustrating a second configuration exampleof the solid-state imaging device 11. FIG. 3A illustrates across-sectional configuration example of the solid-state imaging device11-1 which is the second configuration example, and FIG. 3B illustratesa planar configuration example of the solid-state imaging device 11-1.

As illustrated in FIG. 3B, the solid-state imaging device 11-1 has adifferent configuration from the solid-state imaging device 11 of FIGS.2A and 2B in that four PDs 51 a ₁-1 to 51 a ₄-1 are formed in the phasedifference pixel 21 a-1 and an engraved light shielding film 55-1 isformed in a region for separating the PDs 51 a ₁-1 to 51 a ₄-1 from eachother. In other words, in the solid-state imaging device 11-1, theengraved light shielding film 55-1 is formed into a “cross” shape in aplan view. In addition, otherwise, the solid-state imaging device 11-1has common components with the solid-state imaging device 11 of FIGS. 2Aand 2B, the common components are denoted by the same reference numeralsand thus the detailed description thereof will be omitted.

In the solid-state imaging device 11-1 configured in this manner, sincethe PDs 51 a ₁-1 to 51 a ₄-1 are separated from each other by theengraved light shielding film 55-1, it is possible to prevent theelectric crosstalk and the optical crosstalk between the PDs 51 a ₁-1 to51 a ₄-1. Accordingly, the solid-state imaging device 11-1 can achieve abetter phase difference characteristic similar to that of thesolid-state imaging device 11 of FIGS. 2A and 2B as compared to thesolid-state imaging device of the related art. Further, it is possibleto detect the phase difference in the oblique direction in the phasedifference pixel 21 a-1 as will be described with reference to FIGS. 6Aand 6B.

FIGS. 4A and 4B are diagrams illustrating a third configuration exampleof the solid-state imaging device 11. FIG. 4A illustrates across-sectional configuration example of the solid-state imaging device11-2 which is the third configuration example, and FIG. 4B illustrates aplanar configuration example of the solid-state imaging device 11-2.

As illustrated in FIG. 4B, the solid-state imaging device 11-2 has adifferent configuration from the solid-state imaging device 11 of FIGS.2A and 2B in that four PDs 51 a ₁-2 to 51 a ₄-2 are formed in the phasedifference pixel 21 a-2 and an engraved light shielding film 55-2 isformed in a region for separating the PDs 51 a ₁-2 to 51 a ₄-2 from eachother and separating the phase difference pixel 21 a-2 and otheradjacent pixels 21. In other words, in the solid-state imaging device11-2, the engraved light shielding film 55-2 is formed into a “squarewith cross in the center” shape in a plan view. In addition, otherwise,the solid-state imaging device 11-2 has common components with thesolid-state imaging device 11 of FIGS. 2A and 2B, the common componentsare denoted by the same reference numerals and thus the detaileddescription thereof will be omitted.

In the solid-state imaging device 11-2 configured in this manner, sincethe PDs 51 a ₁-2 to 51 a ₄-2 are separated from each other by theengraved light shielding film 55-2, it is possible to prevent theelectric crosstalk and the optical crosstalk between the PDs 51 a ₁-2 to51 a ₄-2. Further, in the solid-state imaging device 11-2, it ispossible to prevent the electric crosstalk and the optical crosstalkbetween the PDs 51 a ₁-2 to 51 a ₄-2 and the PD 51 b of the adjacentimaging pixel 21 b by the engraved light shielding film 55-2.Accordingly, the solid-state imaging device 11-2 can achieve a betterphase difference characteristic similar to that of the solid-stateimaging device 11 of FIGS. 2A and 2B as compared to the solid-stateimaging device of the related art.

Further, in the phase difference pixel 21 a-2, a white filter 61 a isdisposed corresponding to the phase difference pixel 21 a-2 in the colorfilter layer 33. In this manner, it is possible to increase the receivedlight amount of the PDs 51 a ₁-2 to 51 a ₄-2 and to improve thesensitivity of the pixel signals output by the PDs 51 a ₁-2 to 51 a ₄-2,by applying the white filter 61 a to the phase difference pixel 21 a-2.Thus, the solid-state imaging device 11-2 can achieve a better phasedifference characteristic.

Next, reading of the pixel signals from the phase difference pixel 21a-1 will be described with reference to FIGS. 5A and 5B to FIG. 9.

FIG. 5A illustrates a circuit configuration of the phase differencepixel 21 a-1, and FIG. 5B illustrates a planar configuration example ofthe phase difference pixel 21 a-1.

As illustrated in FIG. 5A, the phase difference pixel 21 a-1 isconfigured to include PDs 51 a ₁-1 to 51 a ₄-1, transfer transistors 71₄ to 71 ₄, an amplifying transistor 72, an FD unit 73, a selectiontransistor 74, and a reset transistor 75, and is connected to a currentsource 24 through a vertical signal line 23.

Further, as illustrated in FIG. 5B, one microlens 62 a is shared withthe PDs 51 a ₁-1 to 51 a ₄-1, and the transfer transistors 71 ₄ to 71 ₄are disposed on the center side of the phase difference pixel 21 a-1.

The PDs 51 a ₁-1 to 51 a ₄-1 are configured in such a manner that theanode electrodes are grounded and the cathode electrodes arerespectively connected to the gate electrode of the amplifyingtransistor 72 through the transfer transistors 71 ₄ to 71 ₄.

The transfer transistors 71 ₄ to 71 ₄ are respectively driven accordingto the transfer signals TG1 to TG4 which are supplied from the verticaldriving unit 13 of FIG. 1. For example, if the transfer signals TG1 toTG4 supplied to the gate electrodes of the transfer transistors 71 ₄ to71 ₄ are at a high level, the transfer transistors 71 ₄ to 71 ₄ areturned ON. Thus, the charges accumulated in the PDs 51 a ₁-1 to 51 a ₄-1are transferred to the FD unit 73 through the transfer transistors 71 ₄to 71 ₄.

The amplifying transistor 72 is an input portion of a source followerwhich is a reading circuit that reads signals obtained by thephotoelectric conversion in the PDs 51 a ₁-1 to 51 a ₄-1, and outputspixel signals of a level corresponding to the charges accumulated in theFD unit 73 to the vertical signal line 23. In other words, theamplifying transistor 72 constitutes the source follower with thecurrent source 24 connected to one end of the vertical signal line 23 bythe drain electrode of the amplifying transistor 72 being connected tothe power supply voltage VDD and the source electrode thereof beingconnected to the vertical signal line 23 through the selectiontransistor 74.

The FD unit 73 is a floating diffusion region having a capacitance Clprovided between the transfer transistors 71 ₁ to 71 ₄ and theamplifying transistor 72, and temporarily accumulates charges that aretransferred from the PDs 51 a ₁-1 to 51 a ₄-1 through the transfertransistors 71 ₁ to 71 ₄. The FD unit 73 is a charge detection unit thatconverts charges into a voltage, and the charges accumulated in the FDunit 73 are converted into a voltage in the amplifying transistor 72.

The selection transistor 74 is driven according to a selection signalSEL supplied from the vertical driving unit 13 of FIG. 1, and when theselection signal SEL supplied to the gate electrode is at a high level,the selection transistor 74 is turned ON and connected to the amplifyingtransistor 72 and the vertical signal line 23.

The reset transistor 75 is driven according to a reset signal RSTsupplied from the vertical driving unit 13 of FIG. 1. For example, whenthe reset signal RST supplied to the gate electrode is at a high level,the reset transistor 75 is turned ON, and the charges accumulated in theFD unit 73 are discharged into the power supply voltage VDD to reset theFD unit 73.

The phase difference pixel 21 a-1 configured in this manner canindependently read charges from the PDs 51 a ₁-1 to 51 a ₄-1 and outputpixel signals of levels corresponding to respective charges. Then, forexample, in the phase difference pixel 21 a-1, a phase difference in anoblique direction is detected based on the pixel signals correspondingto charges which are independently read from a pair of PDs 51 a disposedin the oblique direction.

In FIGS. 6A and 6B, the PD 51 from which pixel signals are read isindicated by being surrounded by dotted lines. For example, asillustrated in FIG. 6A, it is possible to detect a phase difference ofan oblique direction from the upper left to the lower right byindependently transferring the charges of the PD 51 a ₁-1 and the PD 51a ₄-1 which are disposed in an oblique direction to the FD unit 73 andreading the respective pixel signals. Similarly, as illustrated in FIG.6B, it is possible to detect a phase difference of an oblique directionfrom the upper right to the lower left by independently transferring thecharges of the PD 51 a ₂-1 and the PD 51 a ₃-1 which are disposed in anoblique direction to the FD unit 73 and reading the respective pixelsignals.

Further, in the phase difference pixel 21 a-1, it is possible to detecta phase difference in a vertical direction and a horizontal direction.

In FIGS. 7A and 7B, the PD 51 from which pixel signals are read isindicated by being surrounded by dotted lines. For example, asillustrated in FIG. 7A, it is possible to detect a phase difference inthe horizontal direction by independently transferring the charges ofthe PD 51 a ₁-1 and the PD 51 a ₃-1 and the charges of the PD 51 a ₂-1and the PD 51 a ₄-1 to the FD unit 73 and reading the respective pixelsignals. Similarly, as illustrated in FIG. 7B, it is possible to detecta phase difference in the vertical direction by independentlytransferring the charges of the PD 51 a ₁-1 and the PD 51 a ₂-1 and thecharges of the PD 51 a ₃-1 and the PD 51 a ₄-1 to the FD unit 73 andreading the respective pixel signals.

Further, in the phase difference pixel 21 a-1, any one of the PDs 51 a₁-1 to 51 a ₄-1, for example, as illustrated in FIG. 8A, the charges ofonly the PD 51 a ₁-1 may be transferred to the FD unit 73 and the pixelsignals may be read.

Further, as illustrated in FIG. 8B, in the phase difference pixel 21a-1, all charges of the PDs 51 a ₁-1 to 51 a ₄-1 are simultaneouslytransferred to the FD unit 73, the charges are added in the FD unit 73,and the pixel signals may be read. In this manner, the pixel signalsobtained by adding all charges of the PDs 51 a ₁-1 to 51 a ₄-1 can beused as the pixel signals forming an image, similarly to the pixelsignals output by the imaging pixel 21 b. In addition, even in the phasedifference pixel 21 a of FIGS. 2A and 2B, similarly, the charges of thePDs 51 a ₁ to 51 a ₂ are simultaneously transferred to the FD unit, thecharges are added in the FD unit, and the pixel signals can be read.

However, in the phase difference pixel 21 a-1, a gain when theamplifying transistor 72 amplifies the charges accumulated in the FDunit 73 depends on the capacitance of the FD unit 73.

Therefore, for example, when the capacitance of the FD unit 73 is set inorder to obtain a suitable gain for the charge amount at a time oftransferring charges of any one of the PDs 51 a ₁-1 to 51 a ₄-1(hereinafter, appropriately, referred to as a time of reading onepixel), there is a concern that when all charges of the PDs 51 a ₁-1 to51 a ₄-1 are simultaneously transferred to the FD unit 73 (hereinafter,appropriately, referred to as a time of adding all pixels to the FD),the charge amount exceeds the capacitance of the FD unit 73. Thus, thephase difference pixel 21 a-1 is configured to be capable of switchingthe capacitance of the FD between at the time of reading one pixel andat the time of adding all pixels to the FD, and thus it is possible toprevent the charges from exceeding the capacitance of the FD unit 73.

In other words, FIG. 9 illustrates a modified example of the phasedifference pixel 21 a-1.

As illustrated in FIG. 9, the phase difference pixel 21 a-1′ isconfigured to include PDs 51 a ₁-1 to 51 a ₄-1, transfer transistors 71₁ to 71 ₄, an amplifying transistor 72, an FD unit 73, a selectiontransistor 74, a reset transistor 75, a switching transistor 76, and anFD unit 77. In other words, the phase difference pixel 21 a-1′ isdifferent from the phase difference pixel 21 a-1 of FIGS. 5A and 5B inthat it includes the switching transistor 76 and the FD unit 77.

The switching transistor 76 is disposed to be connected to the FD unit73 and the reset transistor 75, and the FD unit 77 is provided in aconnection portion between the switching transistor 76 and the resettransistor 75. The FD unit 77 is a floating diffusion region including acapacitance C2. Then, the switching transistor 76 is driven according toa switching signal FG supplied from the vertical driving unit 13 of FIG.1, and when the switching signal FG is at a high level, the switchingtransistor 76 is turned ON and the FD unit 73 and the FD unit 77 areconnected. In this manner, the capacitance of accumulation of chargestransferred from the PDs 51 a ₁-1 to 51 a ₄-1 is switched by theswitching transistor 76, and thus it is possible to switch theconversion efficiency for converting the charges into a voltage.

Accordingly, at the time of reading one pixel, the switching transistor76 is turned OFF, the charges respectively generated in the PDs 51 a ₁-1to 51 a ₄-1 are accumulated in the capacitance C1 of the FD unit 73.Accordingly, it is possible to accumulate charges with a smallcapacitance and to convert the charges into a voltage with highconversion efficiency.

Meanwhile, at the time of adding all pixels to the FD, the switchingtransistor 76 is turned ON, and thus the FD unit 73 and the FD unit 77are connected, the charges generated in the PDs 51 a ₁-1 to 51 a ₄-1 aresimultaneously accumulated with the capacitance obtained by adding thecapacitance C1 of the FD unit 73 and the capacitance C2 of the FD unit77, and the charges are added. Accordingly, it is possible to accumulatecharges with a great capacitance and to convert the charges into avoltage with low conversion efficiency.

Thus, at the time of reading one pixel, it is possible to convert thecharges into a pixel signal with high gain; and at the time of addingall pixels to the FD, it is possible to prevent the overflow of charges.

In addition, the phase difference pixel 21 a of respective configurationexamples described above can be partially or entirely disposed in thepixel array unit 12 of FIG. 1.

FIGS. 10A and 10B illustrate a part of the pixel array unit 12 in whichthe phase difference pixel 21 a is partially disposed.

In the pixel array unit 12 illustrated in FIG. 10A, the phase differencepixel 21 a-1 illustrated in FIGS. 3A and 3B is partially disposed andimaging pixels 21 b are disposed other than the phase difference pixel21 a-1. Further, in the pixel array unit 12 illustrated in FIG. 10B, thephase difference pixel 21 a-2 illustrated in FIGS. 3A and 3B ispartially disposed and imaging pixels 21 b are disposed other than thephase difference pixel 21 a-1.

FIGS. 11A and 11B illustrate a part of the pixel array unit 12 in whichthe phase difference pixels 21 a are entirely disposed.

In the pixel array unit 12 illustrated in FIG. 11A, the phase differencepixels 21 a-1 illustrated in FIGS. 3A and 3B are entirely disposed.Further, in the pixel array unit 12 illustrated in FIG. 11B, the phasedifference pixels 21 a-2 illustrated in FIGS. 3A and 3B are entirelydisposed.

As illustrated in FIGS. 11A and 11B, it is possible to detect a phasedifference in all phase difference pixels 21 a, by the solid-stateimaging device 11 including the pixel array unit 12 in which the phasedifference pixels 21 a are entirely disposed, and to form an image fromthe pixel signals which are output from all phase difference pixels 21a. Further, in the pixel array unit 12 in which the phase differencepixels 21 a are entirely disposed, it is possible to receive light froma plurality of directions by one phase difference pixel 21 a and tooutput the pixel signals corresponding to the light from the respectivedirections. Thus, it is possible to obtain a stereoscopic image (3Dimage) by independently outputting the pixel signal corresponding to thelight from the respective directions and forming a plurality of imagesfor each of the respective directions of light.

Further, as illustrated in FIGS. 10A and 10B, it is possible to improvepixel sensitivity in the pixel array unit 12 in which the phasedifference pixel 21 a is partially disposed, as compared to the pixelarray unit 12 in which the phase difference pixels 21 a of FIGS. 11A and11B are entirely disposed. In addition, although not being illustrated,the phase difference pixel 21 a of FIGS. 2A and 2B may be partially orentirely disposed in the pixel array unit 12 as illustrated in FIGS.10A, 10B, 11A and 11B.

Next, FIG. 12 is a diagram illustrating a fourth configuration exampleof the solid-state imaging device 11, and FIG. 12 illustrates a planarconfiguration example of the solid-state imaging device 11-3 which isthe fourth configuration example.

As illustrated in FIG. 12, the solid-state imaging device 11-3 isconfigured in such a manner that the phase difference pixels 21 a-3 areentirely disposed in the pixel array unit 12, as illustrated in FIGS.11A and 11B described above. Then, in the phase difference pixel 21 a-3,similarly to the phase difference pixel 21 a-2 of FIGS. 4A and 4B, theengraved light shielding film 55-3 is formed in a region for separatingfour PDs 51 a ₁-3 to 51 a ₄-3 from each other included in the phasedifference pixel 21 a-3 and separating the phase difference pixel 21a-2.

Further, in the solid-state imaging device 11-3, the microlens 62 isdisposed while being shifted by a 1/2 pixel in the vertical directionand the horizontal direction relative to the phase difference pixel 21a-3. In other words, the solid-state imaging device 11-3 is configuredin such a manner that one microlens 62 is shared with the PDs 51 a ₁-3to 51 a ₄-3 respectively included in four adjacent phase differencepixels 21 a-3.

In other words, FIG. 12 illustrates four phase difference pixels 21 a-3,and the microlens 62 is shared with the PD 51 a ₄-3 disposed in a lowerright part of an upper left phase difference pixel 21 a-3, the PD 51 a₃-3 disposed in a lower left part of an upper right phase differencepixel 21 a-3, the PD 51 a ₂-3 disposed in an upper right part of a lowerleft phase difference pixel 21 a-3, and the PD 51 a ₁-3 disposed in anupper left part of a lower right phase difference pixel 21 a-3.

Further, the solid-state imaging device 11-3 is configured in such amanner that four vertical signal lines 23 ₁ to 23 ₄ are disposed at eachphase difference pixel 21 a-3. Accordingly, in the solid-state imagingdevice 11-3, a pixel signal based on charges generated in the four PDs51 a ₁-3 to 51 a ₄-3 included in the phase difference pixel 21 a-3 canbe simultaneously read by the four vertical signal lines 23 ₁ to 23 ₄.In this manner, it is possible to speed up the reading of the pixelsignal in the solid-state imaging device 11-3, by reading independentlyand in a parallel manner the pixel signal based on charges generated inthe PDs 51 a ₁-3 to 51 a ₄-3.

Next, FIGS. 13A and 13B illustrate a modified example of the phasedifference pixel 21 a. FIG. 13A illustrates a phase difference pixel 21a′ which is a modified example of the phase difference pixel 21 aillustrated in FIGS. 2A and 2B, and FIG. 13B illustrates the phasedifference pixel 21 a-2′ which is a modified example of the phasedifference pixel 21 a-2 illustrated in FIGS. 4A and 4B.

In the phase difference pixel 21 a of FIGS. 2A and 2B, the PDs 51 a ₁and 51 a ₂ are separated in the center of the phase difference pixel 21a, and the engraved light shielding film 55 is formed in the center ofthe phase difference pixel 21 a. In contrast, as illustrated in FIG.13A, in the phase difference pixel 21 a′, the PDs 51 a ₁′ and 51 a ₂′are separated at a position shifted from the center of the phasedifference pixel 21 a′, and engraved light shielding film 55 is formedat a position shifted from the center of the phase difference pixel 21a.

Here, the pupil position of an optical system that condenses light tothe solid-state imaging device 11 varies depending on the arrangementposition of the phase difference pixel 21 a in the pixel array unit 12.For example, the pupil position is the center of the phase differencepixel 21 a in the vicinity of the center of the pixel array unit 12, andthe pupil position is a position shifted from the center of the phasedifference pixel 21 a as being close to the vicinity of the end portionof the pixel array unit 12. Accordingly, in the phase difference pixel21 a′ disposed in the vicinity of the end portion of the pixel arrayunit 12, the position at which PDs 51 a ₁′ and 51 a ₂′ are divided iscorrected depending on the pupil position.

In the phase difference pixel 21 a′ illustrated in FIG. 13A, theposition at which PDs 51 a ₁′ and 51 a ₂′ are divided is a positiondeviated from the center, depending on the pupil position P, and theengraved light shielding film 55 is formed in a region at which the PDs51 a ₁′ and 51 a ₂′ are divided. Accordingly, respective sizes of thePDs 51 a ₁′ and 51 a ₂′ which are divided are different.

However, since the smaller one of the PDs 51 a ₁′ and 51 a ₂′ has ashorter distance through which light passes, the light tends to leak toother adjacent pixels 21.

Thus, as illustrated in FIG. 13B, in a phase difference pixel 21 a-2′,an engraved light shielding film 55-2′ is formed in a region in whichthe PDs 51 a ₁′ and 51 a ₂′ are divided and the phase difference pixel21 a-2′ and other adjacent pixels 21 are divided. Thus, as illustrated,it is possible to prevent light from leaking from the PD 51 a ₁-2′ whichis formed to be smaller to other adjacent pixels 21.

Further, the solid-state imaging device 11 described above can beapplied to various electronic apparatuses including imaging systems suchas digital still cameras and digital video cameras, mobile phones withan imaging function, or other apparatuses with an imaging function.

FIG. 14 is a block diagram illustrating a configuration example of animaging apparatus mounted on an electronic apparatus.

As illustrated in FIG. 14, an imaging apparatus 101 is configured toinclude an optical system 102, an imaging device 103, a signalprocessing circuit 104, a monitor 105, and a memory 106, and is capableof capturing still images and moving images.

The optical system 102 is configured to include one or a plurality oflenses, and guides image light (incident light) from an object to theimaging device 103 so as to form an image on a light receiving surface(sensor unit) of the imaging device 103.

As the imaging device 103, a solid-state imaging device 11 includingphase difference pixels 21 a of various configuration examples describedabove is applied. Electrons are accumulated in the imaging device 103for a fixed period, according to an image formed on the light receivingsurface through the optical system 102. Thus, signals according to theelectrons accumulated in the imaging device 103 are supplied to thesignal processing circuit 104.

The signal processing circuit 104 performs various signal processes onthe pixel signals which are output from the imaging device 103. Theimage (image data) obtained by the signal processing circuit 104performing the signal processes is supplied to and displayed on themonitor 105, or is supplied to and stored (recorded) in the memory 106.

In the imaging apparatus 101 configured in this manner, it is possibleto achieve a better phase difference characteristic and to obtain areliably focused image by applying the solid-state imaging device 11including the phase difference pixel 21 a of various configurationexamples described above.

In addition, the present technology may have the followingconfigurations.

(1)

A solid-state imaging device including:

-   -   a plurality of pixels each of which includes        -   a photoelectric conversion unit that generates charges by            photoelectrically converting light; and        -   a transistor that reads a pixel signal of a level            corresponding to the charges generated in the photoelectric            conversion unit,    -   in which a phase difference pixel which is at least a part of        the plurality of pixels is configured in such a manner that the        photoelectric conversion unit is divided into a plurality of        photoelectric conversion units and an insulated light shielding        film is embedded in a region for separating the plurality of        photoelectric conversion units, which are divided, from each        other.

(2)

The solid-state imaging device according to (1),

-   -   in which the phase difference pixel is configured by further        embedding the light shielding film in a region for separating        the phase difference pixel and other adjacent pixels.

(3)

The solid-state imaging device according to (1) or (2),

-   -   in which a white filter is disposed corresponding to the phase        difference pixel, in a color filter layer laminated on a sensor        layer in which the photoelectric conversion unit is formed.

(4)

The solid-state imaging device according to any one of (1) to (3),

-   -   in which the phase difference pixel is configured by dividing        the photoelectric conversion unit into two.

(5)

The solid-state imaging device according to any one of (1) to (4),

-   -   in which the phase difference pixel is configured by dividing        the photoelectric conversion unit into four.

(6)

The solid-state imaging device according to (5),

-   -   in which a phase difference detection is performed based on the        pixel signals corresponding to charges generated in a pair of        the photoelectric conversion units disposed in an oblique        direction, among the four photoelectric conversion units which        are divided.

(7)

The solid-state imaging device according to (5) or (6),

-   -   in which a phase difference detection is performed based on the        pixel signals corresponding to charges generated in a pair of        the photoelectric conversion units disposed in a vertical        direction or a horizontal direction, among the four        photoelectric conversion units which are divided.

(8)

The solid-state imaging device according to any one of (1) to (7),further including:

-   -   a charge detection unit that temporarily accumulates charges        that are transferred from the photoelectric conversion unit and        converts the charges into a voltage,    -   in which charges from the plurality of photoelectric conversion        units which are divided are simultaneously transferred to the        charge detection unit, and the charges are added in the charge        detection unit.

(9)

The solid-state imaging device according to (8), further including:

-   -   a switching transistor that switches a conversion efficiency for        converting charges into a voltage in the charge detection unit.

(10)

The solid-state imaging device according to any one of (1) to (9),

-   -   in which the positions in which the photoelectric conversion        unit is divided into a plurality of photoelectric conversion        units are corrected according to an arrangement position of the        phase difference pixel.

(11)

The solid-state imaging device according to any one of (1) to (10),

-   -   in which the phase difference pixels are disposed entirely in a        pixel array unit in which the pixels are disposed in an array        shape.

(12)

An electronic apparatus including:

-   -   a solid-state imaging device including    -   a plurality of pixels each of which includes        -   a photoelectric conversion unit that generates charges by            photoelectrically converting light; and        -   a transistor that reads a pixel signal of a level            corresponding to the charges generated in the photoelectric            conversion unit,    -   in which a phase difference pixel which is at least a part of        the plurality of pixels is configured in such a manner that the        photoelectric conversion unit is divided into a plurality of        photoelectric conversion units and an insulated light shielding        film is embedded in a region for separating the plurality of        photoelectric conversion units, which are divided, from each        other.

It should be understood that the disclosure is not limited to theabove-described embodiments, but may be modified into various forms in arange without departing from a gist of the disclosure.

What is claimed is:
 1. An imaging device comprising: a substrate; first,second, third, and fourth photoelectric conversion regions disposed inthe substrate; a trench disposed in the substrate; a first microlensdisposed over the first, second, third, and fourth photoelectricconversion regions; and a first insulating film disposed in the trench,wherein the first and the second photoelectric conversion regions arearranged adjacent to one another in a first direction, wherein the thirdand fourth photoelectric conversion regions are arranged adjacent to oneanother in the first direction, wherein the first and the thirdphotoelectric conversion regions are arranged adjacent to one another ina second direction that is perpendicular to the first direction, andwherein the trench is disposed between the first, second, third, andfourth photoelectric conversion regions.
 2. The imaging device accordingto claim 1, further comprising: a fifth photoelectric conversion regiondisposed in the substrate; and a second microlens disposed over thefifth photoelectric conversion region, wherein an area of the fifthphotoelectric conversion region is larger than an area of the firstphotoelectric conversion region.
 3. The imaging device according toclaim 2, wherein the fifth photoelectric conversion region is adjacentto the second and fourth photoelectric conversion regions in the firstdirection.
 4. The imaging device according to claim 1, furthercomprising: a fifth photoelectric conversion region disposed in thesubstrate; a first color filter disposed above the first, second, third,and fourth photoelectric conversion regions; and a second color filterdisposed above the fifth photoelectric conversion region, wherein amaterial of the first color filter is different from a material of thesecond color filter.
 5. The imaging device according to claim 4, whereinthe fifth photoelectric conversion region is adjacent to the second andfourth photoelectric conversion regions in the first direction.
 6. Theimaging device according to claim 1, wherein, in a plan view, the trenchhas a cross shape.
 7. The imaging device according to claim 1, whereinan end of the trench furthest from a light-receiving surface of thesubstrate is at a location in the substrate that is between the first,second, third, and fourth photoelectric conversion regions.
 8. Theimaging device according to claim 1, further comprising: a secondinsulating film disposed on the first insulating film.
 9. The imagingdevice according to claim 8, further comprising: a metal disposed in thetrench and surrounded on three sides by the first insulating film. 10.The imaging device according to claim 9, wherein the second insulatingfilm is on a fourth side of the metal.